高能工業(yè)CT采用先進(jìn)的高頻恒壓X射線源、數(shù)字成像探測(cè)器以及高精度機(jī)械檢測(cè)平臺(tái)。不僅再現(xiàn)了被檢測(cè)工件的CT斷層及三維圖像，同時(shí)擁有二維實(shí)時(shí)成像功能。產(chǎn)品具有體積小、檢測(cè)速度快、圖像清晰、檢測(cè)、性?xún)r(jià)比高等諸多*性。產(chǎn)品廣泛應(yīng)用于航天、航空、機(jī)械、鑄造、IT、汽車(chē)等行業(yè)的無(wú)損檢測(cè)和無(wú)損測(cè)量。
該產(chǎn)品技術(shù)已獲得國(guó)家發(fā)明。
Industrial CT system adopts advanced high frequency and constant voltage x-ray source, digital detector, and high precision mechanical test plate system. The system not only displays the multifaceted 3-D view image of the tested object, but also owns 2-D real-time image function. Its merits are as followings: small size, high speed test, definite images, accurate detection and high ratio of performance to price. So it is widely used for spaceflight industry, shipbuilding industry, millitary industry, machinery industry, casting industry, IT, auto industry and other NDT and NDE fields.
The technology of this product received the China's National patents.
主要功能
●采用錐束CT掃描和DR實(shí)時(shí)成像多種檢測(cè)方式，根據(jù)檢測(cè)工件大小，一次掃描得到從幾十層到幾千層的斷層圖像。
●多種能量Ｘ射線源，適用不同的檢測(cè)工件。
●成像方式可選擇多種探測(cè)器。
●具有缺陷、孔隙分析和被檢測(cè)工件制定區(qū)域功能。
●用不同顏色標(biāo)識(shí)檢測(cè)缺陷體積、位置尺寸。
●分析缺陷尺寸統(tǒng)計(jì)，計(jì)算孔隙總百分比，并做孔隙體積的直方圖。
●分析壁厚：用不同顏色標(biāo)識(shí)分析結(jié)果。
●測(cè)量工具：測(cè)量工件位置、距離、半徑、角度等參數(shù)。
●逆向工程：CAD設(shè)計(jì)和實(shí)物比較。
●分割工具：數(shù)據(jù)集中，根據(jù)材料和幾何結(jié)構(gòu)進(jìn)行分割。
●可實(shí)現(xiàn)被檢測(cè)工件內(nèi)部尺寸的測(cè)量。
Main functions :
●Using cone-beam CT scans and a Real-time imaging DR testing method, based on detection of the workpiece size, simply one scanned can constructs from tens to thousands of layers layer tomographic images.
●Multiple X-ray sources and different X-ray focus( micro focus, small focus ) suit for different workpieces to be tested.
●Various of detectors can be chosen for imaging.
●With the function of analyzing flaw and pore and defining tested object's zone.
●Use different color to mark flaw's size and position.
●Analyze the size of flaws, count the percent of pores and use the data to draw histogram of pore size.
●Analysis of wall thickness: analyze results through different color marks.
●Measurement tools: measure the position, distance, radius, angle and other parameters of workpiece tested.
●Reverse engineering：CAD design and comparison with real object.
●Segmentation tool: data collection, and then get the images divided according to the different materials and different geometry.
●Achieve accurate measurement of internal dimensions of workpiece tested.
主要技術(shù)參數(shù)
●管電壓：20kV~450kV
●焦點(diǎn)尺寸：1μm~ 0.4mm
●空間分辨力：0.5μm
●密度分辨率：0.3%~0.5%
●掃描方式：錐束掃描
●探測(cè)器：數(shù)字平板探測(cè)器或圖像增強(qiáng)器
●圖像重建速度：1024×1024像素單層圖像只用時(shí)0.2秒
Main technical parameters:
●Tube voltage: 20kV~450kV
●Focus size: 1μm~ 0.4mm
●Spatial resolution:0.5μm
●Density resolution: 0.3%~0.5%
●Scan method: cone beam scanning
●Detector: digital flat detector or image intensifier
●Speed of rebuilding images: 1024 ×1024 pixel image by 0.2 second
(空格分隔,最多3個(gè),單個(gè)標(biāo)簽最多10個(gè)字符)
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